?2005 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN5069 Rev. 1.1.5
18
Design Tools
Fairchild application note AN-6010 provides a PSPICE
model and spreadsheet calculator for the PWM regula-
tor, simplifying external component selections and verify-
ing   loop   stability.   The   topics   covered   provide   an
understanding of the calculations in the spreadsheet.
The spreadsheet calculator, which is part of AN-6010,
can be used to calculate all external component values
for designing around FAN5069. The spreadsheet pro-
vides optimized compensation components and gener-
ates a Bode Plot to ensure loop stability.
Based on the input values entered, AN-6010s PSPICE
model can be used to simulate Bode Plots (for loop sta-
bility) as well as transient analysis to help customize the
design for a wide range of applications.
Use Fairchild Application Note AN-6005 for prediction of
the losses and die temperatures for the power semicon-
ductors used in the circuit.
AN-6010   and   AN-6005   can   be   downloaded   from
www.fairchildsemi.com/apnotes/
.
Layout Considerations
The switching power converter layout needs careful
attention and is critical to achieving low losses and clean
and stable operation. Below are specific recommenda-
tions for good board layout:
?SPAN class="pst FAN5069EMTCX_2464147_4">  Keep the high-current traces and load connections as 
short as possible.
?SPAN class="pst FAN5069EMTCX_2464147_4">  Use thick copper boards whenever possible to 
achieve higher efficiency.
?SPAN class="pst FAN5069EMTCX_2464147_4">  Keep the loop area between the SW node, low-side 
MOSFET, inductor, and the output capacitor as small
as possible.
?SPAN class="pst FAN5069EMTCX_2464147_4">  Route high dV/dt signals, such as SW node, away 
from the error amplifier input/output pins. Keep com-
ponents connected to these pins close to the pins.
?SPAN class="pst FAN5069EMTCX_2464147_4">  Place ceramic de-coupling capacitors very close to the 
VCC pin.
?SPAN class="pst FAN5069EMTCX_2464147_4">  All input signals are referenced with respect to AGND 
pin. Dedicate one layer of the PCB for a GND plane.
Use at least four layers for the PCB.
?SPAN class="pst FAN5069EMTCX_2464147_4">  Minimize GND loops in the layout to avoid EMI-related 
issues.
?SPAN class="pst FAN5069EMTCX_2464147_4">  Use wide traces for the lower gate drive to keep the 
drive impedances low.
?SPAN class="pst FAN5069EMTCX_2464147_4">  Connect PGND directly to the lower MOSFET source 
pin.
?SPAN class="pst FAN5069EMTCX_2464147_4">  Use wide land areas with appropriate thermal vias to 
effectively remove heat from the MOSFETs.
?SPAN class="pst FAN5069EMTCX_2464147_4">  Use snubber circuits to minimize high-frequency ring-
ing at the SW nodes.
?SPAN class="pst FAN5069EMTCX_2464147_4">  Place the output capacitor for the LDO close to the 
source of the LDO MOSFET.
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